High Thermal Conductivity Aluminum Nitride Ceramics

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Hefei Mok Advanced Material Technology Co.,ltd.

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High Thermal Conductivity Aluminum Nitride Ceramics


company	Hefei Mok Advanced Material Technology Co.,ltd.
Categories	LED Displays
Update	2011-07-18
Original Region	China
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High Thermal Conductivity Aluminum Nitride Ceramics

AlN based ceramic material possesses good thermal conductivity, reliable electrical insulation, low dielectric constant and consumption, high strength and extraordinary machinability.

Aluminum nitride	AlN120	AlN140	AlN160	AlN180
Color	Dark Gray	Dark Gray	Translucent Medium gray	Translucent Medium gray
Surface roughness, Ra (μｍ)	0.6max	0.6max	0.5max	0.5max
Density(g/cm3)	3.25	3.26	3.33	3.33
Flexural strength( MPa)	>320	>300	>300	>300
Compressive Strength (GPa)	2.1	2.1	2.0	2.0
Fracture toughness? (MPa m1/2)	3.30±0.05	3.30±0.05	3.35±0.05	3.35±0.05
Young’s modulus(GPa)	300	300	310	310
Thermal conductivity(W/mK)	120±10%	140±10%	160±10	180±10
Coeff.of thermal expansion (10-6 K-1)RT- 100℃	3.6	3.6	3.6	3.6
Volume resistivityΩcm)	>1012	>1012	>1013	>1013
Dielectric strength (KV/mm)	≥18	≥18	≥20	≥20
Dielectric constant@1MHz)	9.0±10%	9.0±10%	9.0±10%	9.0±10%
Melting point	2500℃	2500℃	2500℃	2500℃

Applications

It can be used for fabricating high thermal conductivity magnetism-free skeleton materials, microwave dielectric materials, high-temperature resistant, insulating and erosion-resistant structural ceramic materials and products.

(1) Circuit substrates of power semiconductor modules,power microwave device and IC packages

(2) Heat sink materials for power transisitors,thyristors,LDs and LEDs

(3) Electronic device and semiconductor refrigerations

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